TCP Automatic Loading and Unloading Dipping Machine with vacuum debubble function

LGTM-6191-2V
TCP Automatic Loading and Unloading Dipping Machine with vacuum debubble function
Product Description
Application： for chips terminal dipping of passive components
Carrier： Thin Carrier Plate series, TCP
Chips： 0201, 0402, 0603, 0805 (inch)and above
Capacity： Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.
Q'ty : Inquiry
  • Put the TCP on machine by labor.
  • Use vacuum approach to put TCP through the chips dipping process
  • Vacuum debubble mechanism: Debuble tray goes to vacuum position to remove air bubble in paste.
  • For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.05mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 2900 (L)*1330 (W) *2091 mm (H)
  • Weight: 2000 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 3ψ220V(380V), customable
  • Electric current: 17(A)
  • Power consumption: 6.1(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 70 (l/min)