TCP Automatic Double Side Loading and Unloading Dipping Machine

LGTM-6192-DSVR
TCP Automatic Double Side Loading and Unloading Dipping Machine
Product Description
Application： for chips terminal dipping of passive components
Carrier： Thin Carrier Plate series, TCP
Chips： 0201, 0402, 0603, 0805 (inch)and above
Capacity： Depends on chips’ specification which will affect capacity. For example, the capacity of chip 0402 (1005mm) is about 826 K/hr.

Additional files

Terminal_Chip.jpg
Q'ty : Inquiry
  • Load: After insert, TCPs are placed in cassette and put on load cassette position by labor.
  • All transportation between machine stations are tranposrtated by robot.
  • Low-temperature oven(70℃): Before dipping, TCP is put on the low temperature oven to preheat chips.
  • Chip surface debris cleansing mechanism: clean debris on chip surface.
  • Laser paste check: when distributing paste, machine check if there is debris fallen on the paste.
  • Dipping: Use vacuum approach to put TCP through the chips dipping process.
    • Standard
      Diphead straight up and down
    • S movement
      Diphead draws a circle when moving up
    • SX movement
      Diphead repeatly draws circle clockwise and counterclockwise when moving up
    • 8 movement
      Diphead repeatly draws circle counterclockwise, and then draws circle clockwise to form a 8 pattern when moving up 
  • Rotate track: When set double side dipping, robot moves first side dipped chips to the position to rotate to second side, then continue second side dipping.
  • Vacuum debubble mechanism: Debuble tray goes to vacuum position to remove air bubble in paste.
  • For chips below 0603 (1608), suitable single side chip dipping manufacturing process; for chips above 0603 (1608), suitable two sides chip dipping manufacturing process and unnecessary to transfer.
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.05mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 2250 (L)*1500 (W) *2100 mm (H)
  • Weight: 1850 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 3ψ220V(380V), customable
  • Electric current: 21(A)
  • Power consumption: 8(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 40 (l/min)
Introducing the LGTM-6192-DSVR, a state-of-the-art automatic loading and unloading dipping machine tailored for the efficient processing of chips terminal dipping in passive components. This double side dipping machine is equipped with advanced features such as a robotic arm for precise handling, ensuring high productivity and reliability in your operations.
Designed to accommodate various chip sizes, including 0201, 0402, 0603, and 0805 inches, the LGTM-6192-DSVR adapts to meet your specific production needs. With a capacity of approximately 826 K/hr for 0402 chips, this machine guarantees efficiency without compromising on quality.


Key Features:
  • Robotic Arm Integration:** Ensures precise and automated handling, minimizing manual intervention.
  • Double Side Dipping Capability:** Facilitates comprehensive processing with a seamless transition between sides.
  • Advanced Precision:** Guarantees paste thickness accuracy of ±0.01mm and action precision of ±0.002mm, ensuring consistency across batches.
Whether you're looking to enhance your current production line or upgrade to the latest in dipping technology, the LGTM-6192-DSVR is your ideal solution. For more information, please get in touch with us.
Product Introduction
For more details, please contact us.