Dipping Machine for SUS Plate

LGTM-6110-S
Dipping Machine for SUS Plate
Product Description
Application： for chips terminal dipping of passive components
Carrier： SUS plate series
Chips： 0201, 0402, 0603, 0805(inch) and above
Capacity： Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry
  • Put the TCP on machine by labor.
  • Use vacuum approach to put TCP through the chips dipping process
  • Suitable single side chip dipping manufacturing process
  • Paste thickness precision:±0.005mm
  • Action precision: ±0.001mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.01mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 1250 (L)*1100 (W) *1950 mm (H)
  • Weight: 700 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 3ψ220V(380V), customable
  • Electric current: 8.7(A)
  • Power consumption: 3.3(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 72 (l/min)