Dipping Machine for Carrier Plate

LGTM-4000C
Dipping Machine for Carrier Plate
Product Description
Application：  for chips terminal dipping of passive components
Carrier： Carrier Plate series, CP
Chips：  
Capacity： Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry

Load chips：Using Vibration-Loading Machine, Vibration-Loading Box, Load Plate, Carrier Plate, Non-Hole Flat Plate(except 6048).

  • Insert chips：Using Air Presser, Press Conversion, Insert Spacer to make chips protrude up.
  • Dip the first side of CP：Using Dipping Machine.
  • Dry dipped chips：Using Dryer.
  • Transfer：Using Air Presser, Press Conversion, Transfer Plate, Flat Plate (except 6048) to transfer the dipped side into another empty carrier plat, making the un-dipped side protrude up.
  • Dip the second side of CP：Using Dipping Machine.
  • Dry dipped chips：Using Dryer.
  • Unload chips：Using Air Presser、Press Conversion、Unload Box.
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.01mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 1050 (L)*1000 (W) *2000 mm (H)
  • Weight: 640 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V
  • Electric current: 10(A)
  • Power consumption: 1.9(KW)
  • Frequency: 50/60Hz
  • Air Consumption: 5.5 (l/min)