Array Manual Dipping Machine
- Operational Process
- Technical Precision
- Machine Specification
- Electric Control
- Associate with equipments
- Put the TCP on machine by labor.
- Use vacuum approach to put TCP through the chips dipping process
- Suitable single side chip dipping manufacturing process
- ATCP hole position precision: ±0.015mm
- Parallelism tolerance between dipping plate and ink tray:±0.01mm
- Paste thickness precision:±0.015mm
- Action precision:±0.001mm
- Dimension: 1250 (L)*1100 (W)*1950 (H)mm
- Weight: 600KGS
- Controller: PLC, HMI, Servo Motor…
- Voltage: 220V(380V), customable
- Electric current: 8.7A(5A)
- Power consumption: 3.3(KW)
- Frequency: 50/60Hz
- Air Consumption: 0.5 (l/min)
Inserting M/C, Bottom Air Press, Level Air Press, Press Plate, Bottom Press Conversion, Paste Plate, TCP, Lord Plate, Transfer Plate, Unloading Plate and Storage Box.