Dipping Machine for Carrier Plate

LGTM-2009
Dipping Machine for Carrier Plate
Product Description
Application： for chips terminal dipping of passive components
Carrier： Carrier Plate series, CP
Chips： 0402, 0603, 0805 and above
Capacity： Depends on chips’ specification which will affect capacity.
Q'ty : Inquiry
  • Paste thickness precision:±0.01mm
  • Action precision: ±0.002mm
  • Ink tray plate flatness: ±0.005mm
  • The parallelism tolerance between dipping plate and ink tray: ±0.05mm
  • Adjustable Ink tray thickness:±0.001mm
  • Dimension: 875 (L)*900 (W) *1500 mm (H)
  • Weight: 720 Kgs
  • Controller: PLC, HMI, Servo Motor…
  • Voltage: 220V
  • Electric current：10(A)
  • Power consumption：50/60HZ
  • Frequency：5.5(1/min)
  • Air Consumption：1.9(KW)