Inserting:

• Put the Flatness Plate on the lower Unloading late.
• After completed vibration chips, put the both Load Plate and CP together onto Flatness Plate.
• Start the switch to put the punch-pin of Press Conversion down, and then insert the chips into holes of CP.

Transferring:

• Put the Transfer Plate and empty CP onto completed single side dipping of CP (dipping side face up).
• Take the both CP and Transfer Plate together for transferring and then put them to lower Unloading Plate (empty CP at under layer)
• Start the switch to let the punch-pin of upper Press Conversion down, and put the single side dipping chips inserting into empty CP through Transfer Plate. (Noted: after this motion, un-dipping side should be face up)

Unloading:

• Put the completed bilateral sides dipping of CP to lower unloading plate by labor.
• Start the switch to let the punch-pin of upper Press Conversion down and press the chips into Unloading Plate.