2020-04-09

Single Side Dipping Process from Top Inserting: For 0805(2012mm) above chips

Dipping ProcessEquipmentEquipment
① Load Chips Chip Loading Box, Loading Machine Load Plate, Support Plate, Carrier Plate (TCP)
② Insert Chips (Protrusion) Air Press from Top Top Press Conversion, Pins, Spacer for Top Insert, Unload Plate
③ Level Chips Air Press for Level Bottom Level Plate (with flatness), Spacer for Level
④ Dipping First side TCP Series Dipping Machine (LGTM-6822、LGTM-6191、LGTM-6168) Vacuum Plate
⑤ Drying First time Dryer TCP Cassette
⑥ Transfer Chips (Protrusion) Air Press from Top Top Press Conversion, Unload Plate (with holes), Spacer for Transfer
⑦ Level Chips Air Press for Level Bottom Level Plate (Flatness), Spacer for Level
⑧Dipping Second side TCP Series Dipping Machine (LGTM-6822、LGTM-6191、LGTM-6168) Vacuum Plate
⑨ Drying Second time Dryer TCP Cassette
⑩ Unload Chips Air Press from Top Top Press Conversion, Unload Plate

Single Side Dipping Process from Bottom Inserting

Dipping ProcessEquipmentConsumables
① Load Chips Chip Loading Box, Loading Machine Load Plate
② Insert Chips (Protrusion) Air Press from Bottom Bottom Press Conversion, Top Press Plate (with holes), Thin Carrier Plate, Pins, Spacer for Bottom Insert
③ Level Chips Air Press for Level Bottom Level Plate (with flatness), Spacer for Level
④ Dipping First side TCP Series Dipping Machine (LGTM-6822、LGTM-6191、LGTM-6168) Vacuum Plate
⑤ Drying First time Dryer Cassette
⑥ Transfer Chips (Protrusion) Air Press from Top Top Press Conversion, Unload Plate (with holes), Spacer for Transfer
⑦ Level Chips Air Press for Level Bottom Level Plate (Flatness), Spacer for Level
⑧Dipping Second side TCP Series Dipping Machine (LGTM-6822、LGTM-6191、LGTM-6168) Vacuum Plate
⑨ Drying Second time Dryer Cassette
⑩ Unload Chips Air Press from Top Top Press Conversion, Unload Plate

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