Dipping Process for Array Dipping with Three Air Press
2020-04-09
Dipping Process for Array Dipping with Three Air Press (Standard Process)
| Dipping Process | Equipment | Consumables |
|---|---|---|
| ① Load Chips | Chip Loading Box, Loading Machine | Load Plate |
| ② Insert Chips (Protrusion) | Air Press from Bottom | Bottom Press Conversion, Top Press Plate, Pins, Spacer for Insert, Attay Thin Carrier Plate (ATCP) |
| ③ Level and Transfer Chips | Air Press for Level | Top Pin Plate, Level Plate (with holes), Spacer for Level |
| ④ Dipping First side | Array Series Dipping Machine (LGTM-3910、LGTM3968) | Vacuum Plate |
| ⑤ Drying First time | Dryer | ATCP Cassette |
| ⑥ Level and Transfer Chips (Protrusion) | Air Press for Level | Top Pin Plate, Level Plate (with holes), Spacer for Level |
| ⑦Dipping Second side | Array Series Dipping Machine (LGTM-3910、LGTM3968) | Vacuum Plate |
| ⑧ Drying Second time | Dryer | ATCP Cassette |
| ⑨Unload Chips | Air Press for Level | Top Pin Plate, Unload Plate, Spacer for Unload |
