CP Dipping Process
Single Side Dipping Process from Top Inserting: For 0603(1608mm) above chips
Dipping Process | Equipment | Consumables |
---|---|---|
① Load Chips | Chip Loading Box, Loading Machine | Load Plate, Carrier Plate (CP) |
② Insert Chips (Protrusion) | Air Press from Top | Load Plate, Carrier Plate (CP), Top Press Conversion, Support Plate, Pins, Spacer for Insert, Unload Plate |
③Dipping First side | LGTM-4000C Dipping Machine (with Leveling Function) | |
④Drying first time | Dryer | CP Cassette |
⑤Transfer Chip (Protrusion) | Air Press from Top | Carrier Plate (CP), Transfer Plate, Top Press Conversion, Spacer for Transfer, Support Plate, Unload Plate, Pins |
⑥Dipping Second side | LGTM-4000C Dipping Machine (with Leveling Function) | |
⑦Drying Second time | Dryer | CP Cassette |
⑧Unload Chips | Air Press from Top | Top Press Conversion, Unload Plate |