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Single Side Dipping Process from Top Inserting: For 0603(1608mm) above chips

Dipping ProcessEquipmentConsumables
① Load Chips Chip Loading Box, Loading Machine Load Plate, Carrier Plate (CP)
② Insert Chips (Protrusion) Air Press from Top Load Plate, Carrier Plate (CP), Top Press Conversion, Support Plate, Pins, Spacer for Insert, Unload Plate
③Dipping First side LGTM-4000C Dipping Machine (with Leveling Function)
④Drying first time Dryer CP Cassette
⑤Transfer Chip (Protrusion) Air Press from Top Carrier Plate (CP), Transfer Plate, Top Press Conversion, Spacer for Transfer, Support Plate, Unload Plate, Pins
⑥Dipping Second side LGTM-4000C Dipping Machine (with Leveling Function)
⑦Drying Second time Dryer CP Cassette
⑧Unload Chips Air Press from Top Top Press Conversion,  Unload Plate