ATCP-3 Terminal Dipping Process for Array Dipping with Two Air Press
2020-04-09
Dipping Process for Array Dipping with Two Air Press (Small Amount)
Dipping Process | Equipment | Consumables |
---|---|---|
① Load Chips | Chip Loading Box, Loading Machine | Load Plate |
② Insert Chips (Protrusion) | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Load Plate, Pins, Spacer for Insert/transfer, Array Thin Carrier Plate (ATCP) |
③ Level Chips | Air Press for Level | Top Level Plate, Bottom Level Plate (with holes), Spacer for Level |
④ Dipping First side | Array Series Dipping Machine (LGTM-3910、LGTM-3968) | Vacuum Plate |
⑤ Drying First time | Dryer | ATCP Cassette |
⑥ Transfer Chips (Protrusion) | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Pins, Spacer for Insert/transfer, Array Thin Carrier Plate (ATCP), Transfer Plate |
⑦ Level Chips | Air Press for Level | Top Level Plate, Bottom Level Plate (with holes), Spacer for Level |
⑧ Dipping Second side | Array Series Dipping Machine (LGTM-3910、LGTM-3968) | |
⑨ Drying Second time | Dryer | Cassette |
⑩ Unload Chips | Air Press from Bottom (Insert/transfer/unload) | Bottom Press Conversion, Top Press Plate, Pins, Spacer for Unload, Array Thin Carrier Plate (ATCP), Unload Cover Plate |